HYBRID INTEGRATED CIRCUIT,申请号JP19880317234-传众专利搜索

HYBRID INTEGRATED CIRCUIT

申请公布号：JPH02162791(A)

申请号：JP19880317234

申请日期：1988.12.15

申请公布日期：1990.06.22

申请人：

ROHM CO LTD

发明人：NARITA ATSUHIKO

分类号：H05K3/28;H05K3/46

主分类号：H05K3/28

摘要：<p>PURPOSE:To enable a hybrid integrated circuit itself to have a shielding effect without using a metal cover by a method wherein the periphery of an electronic circuit unit is covered with a resin material mixed with a powder which is possessed of a shielding property. CONSTITUTION:Two or more lead terminals 3 are solder to the end of a board 1, and the periphery of an electronic circuit unit other than the lead terminals 3 is covered with a resin material 5. The resin material 5 is for instance formed of epoxy or phenol resin to which magnetic ceramic powder of ferrite or the like is mixed, and the whole electronic circuit unit composed of the board 1 and electronic components 2 is magnetically shielded by a magnetic material. If a pin 4 connected to a common potential such as a GRN potential of an electronic circuit or a power potential is provided to the board 1 as protruding, the periphery of the electronic circuit unit is covered with an insulating resin material 6 as a first layer, and a conductive resin material 7 is deposited thereon as a second layer. The conductive resin material 7 is electrically connected with the pin 4 and deposited so as not to be electrically connected to the lead terminals 3.</p>