PROCESS AND DEVICE OF EXPOSURE,申请号JP19880055442-传众专利搜索

PROCESS AND DEVICE OF EXPOSURE

申请公布号：JPH01228130(A)

申请号：JP19880055442

申请日期：1988.03.08

申请公布日期：1989.09.12

申请人：

HITACHI LTD

发明人：KOMORIYA SUSUMU;NAKAGAWA SHINYA;HANAJIMA SHUICHI;OOSAKAYA TAKAYOSHI

分类号：H01L21/68;G03F7/20;G03F9/00;H01L21/027;H01L21/30

主分类号：H01L21/68

摘要：<p>PURPOSE:To enable various optimum preset values for exposure to be computed with high precision and within a short time by a method wherein the quantity of exposed light passing through the translucent patterns of a specimen mask mounted on the arrangement position of a negative and an exposure specimen sheet is directly measured. CONSTITUTION:When a negative and an exposed element are aligned with each other, a specimen mask 5 whereon specified translucent patterns 7a, 7b are formed is mounted on the arrangement position of the negative simultaneously, an exposure specimen sheet 14 whereon a transmission pattern in specified shape is formed is mounted on the arrangement position of the exposed element. Then, the optimum position of the exposed element is detected by measuring the quantity of exposed light irradiated from the rear side of the negative. Thus, various optimum preset values for exposure can be computed with high precision and within a short time without performing the actual exposure process of test wafer by directly measuring the exposed light passing through the translucent patterns of the specimen mask 5 mounted on the arrangement position of the negative and the exposure specimen sheet 14. Through these procedures, a circuit pattern can be exposed efficiently with high precision.</p>