RESIN SEALED TYPE SEMICONDUCTOR DEVICE

申请公布号：JPH01205450(A)

申请号：JP19880029601

申请日期：1988.02.10

申请公布日期：1989.08.17

申请人：

MITSUBISHI ELECTRIC CORP

发明人：UENISHI AKIO

分类号：H01L23/34;H01L23/28

主分类号：H01L23/34

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