Method for filling trenches from a seed layer

申请公布号：US4847214(A)

申请号：US19880182816

申请日期：1988.04.18

申请公布日期：1989.07.11

申请人：

MOTOROLA INC.

发明人：ROBB, FRANCINE Y.;ROBINSON, F. J.;SVECHOVSKY, BRIDGET;WOOD, THOMAS E.

分类号：H01L21/302;H01L21/3065;H01L21/76;H01L21/763;H01L21/822;H01L27/04

主分类号：H01L21/302

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