PACKAGE FOR SURFACE MOUNTING,申请号JP19870065186-传众专利搜索

PACKAGE FOR SURFACE MOUNTING

申请公布号：JPS63229842(A)

申请号：JP19870065186

申请日期：1987.03.19

申请公布日期：1988.09.26

申请人：

IBIDEN CO LTD

发明人：KAWADE MASANORI;TAKASAKI YOSHINORI

分类号：H01L23/12;H01L23/50;H05K3/34;H05K3/36

主分类号：H01L23/12

摘要：PURPOSE:To obtain the package for surface mounting by a method wherein a through hole is provided at the position corresponding to the connection part of the conductive circuit of a printed wiring board, a side through hole is provided on the end face of a substrate, and a bump is provided at the tip of a conductive pin in the through hole. CONSTITUTION:A high density mounting is performed by providing the I/O terminal, to be connected to the pad 12 of a printed wiring board 11, on both inside and outside of the package 1 to be used for mounting. The inside I/O terminal is constructed in such a manner that a through hole 4 is provided on the package 1 and a part of a conductor pin 3 is inserted. As a result, when the pin 3 is mounted, a gap 13 is generated between the pin 3 and the wiring board 11 in the amount of the part where the pin 3 is positioned outside, the heat-radiating property is made excellent, the distortion of solder generated by the difference in thermal expansion coefficient and the heat capacity between the package 1 and the wiring board 11 is reduced and the defective connection can also be reduced.