REPAIR OF PRINTED CIRCUIT BOARD,申请号JP19860275513-传众专利搜索

REPAIR OF PRINTED CIRCUIT BOARD

申请公布号：JPS62206894(A)

申请号：JP19860275513

申请日期：1986.11.20

申请公布日期：1987.09.11

申请人：

INTERNATL BUSINESS MACH CORP <IBM>

发明人：JIYOSEFU ANDORIYUU ROOSETSUKU;JIEEMUZU REIMONDO TESHIA

分类号：H05K1/02;H05K3/22

主分类号：H05K1/02

摘要：Repair of defects in a printed circuit board, the defects including a break in a strip conductor and a short between two strip conductors, is accomplished by use of a milling machine cutter which is operated in a direction normal to a surface of the board to bring the cutter to a repair site at the defective conductor. The cutter is then advanced partway into the conductor and translated along the conductor in preparation for soldering of braze repairing a break or, alternatively, the cutter is advanced beyond the depth of shorting material after which translation along the surface serves to rout out shorting material. Transverse movement of the cutter also removes any coating which may be present on the circuit board, which coating need be removed prior to soldering or braze repair, and may be replaced after soldering or braze repair. A microscope and pellicule are positioned for aligning the cutter with the repair site. Repair is accomplished by a method including the establishment of an electric potential between a portion of the faulty conductor and the cutter, there being a change in voltage upon a contact of the cutter with the conductor, which change in voltage signals such contacting, thereby to allow for precise positioning of the cutter.