RESIN-SEALED SEMICONDUCTOR DEVICE,申请号JP19850018361-传众专利搜索

RESIN-SEALED SEMICONDUCTOR DEVICE

申请公布号：JPS61177754(A)

申请号：JP19850018361

申请日期：1985.01.31

申请公布日期：1986.08.09

申请人：

MITSUBISHI ELECTRIC CORP

发明人：NAKATSUKA MASANORI

分类号：H01L23/28;H01L21/60;H01L23/492

主分类号：H01L23/28

摘要：<p>PURPOSE:To enable the inhibition of solder outflow during brazing, and to contrive the reduction of cracks and the like of semiconductor pellets, prevention of characteristic deterioration, and improvement in reliability, by a method wherein only the main surface of a thermal stress buffer is plated, but the side surface is not plated. CONSTITUTION:Thermal stress buffers 15, 16 plated only over the main surface, not plated over the side surface are used as the thermal stress buffers to be brazed to a semiconductor pellet 1. A semiconductor basic element is produced by brazing the buffers 15, 16 and an outer terminal lead-out electrode 4 to the semiconductor pellet 1. In this case, even when solders 12, 13 flow out in the back side of the pellet 1, they do not flow to the side surface of the buffer 16; besides, even when a solder 11 flows out in the front side, it does not flow to the side surface of the buffer 15. Therefore, there is no possibility that the thickness of solder cannot be secured, or that said electrode 4 short-circuits with the back of the pellet 1; accordingly, a characteristic deterioration such as the cracking of pellet 1 is not generated.</p>