PRINTED CIRCUIT BOARD STRUCTURE FOR METAL PACKAGE CONTAINING HIGH-FREQUENCY COMPONENT

申请公布号：CA1202733(A)

申请号：CA19840456035

申请日期：1984.06.06

申请公布日期：1986.04.01

申请人：

NEC CORPORATION

发明人：UMETSU, SHINJIRO;YOSHIZAWA, SHIGEO

分类号：H01R4/64;H03H9/10;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K1/02

主分类号：H01R4/64

摘要：<p>According to the present invention, there is provided a printed circuit board structure mounting a metal package with a circuit component for use in a high-frequency region contained therein. The structure comprises a grounding hole bored partially in an area of the printed circuit board under the metal package; and means for connecting the metal package with conductors on the printed circuit board via the grounding hole. A method for making the structure is also disclosed.</p>

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