CONVERSION SPACER FOR SURFACE MOUNTING,AND METHOD FOR SURFACE MOUNTING OF THROUGH-HOLE MOUNTED TYPE ELECTRONIC COMPONENT ON ELECTRONIC BOARD USING THIS,申请号JP20010134108-传众专利搜索

CONVERSION SPACER FOR SURFACE MOUNTING,AND METHOD FOR SURFACE MOUNTING OF THROUGH-HOLE MOUNTED TYPE ELECTRONIC COMPONENT ON ELECTRONIC BOARD USING THIS

申请公布号：JP2002329560(A)

申请号：JP20010134108

申请日期：2001.05.01

申请公布日期：2002.11.15

申请人：

NEC COMPUTERTECHNO LTD

发明人：KONDO JUN

分类号：H01R33/06;H05K1/18;(IPC1-7):H01R33/06;H01R12/32

主分类号：H01R33/06

摘要：<p>PROBLEM TO BE SOLVED: To realize the high density mounting on an electronic board in mounting a through-hole mounted type electronic component. SOLUTION: The through-hole mounted type electronic component is surface mounted by using a conversion spacer composed of a conversion spacer seat 1; through-hole replacement parts 2-1, 2-2 into which pins of the through-hole mounted type electronic component are inserted; and board mounting pins 3-1, 3-2 connected to the through-hole replacing parts 2-1, 2-2. Consequently, the pins of the through-hole mounted type electronic component are shortened, inserted into the through-hole replacing parts 2-1, 2-2, and fixed with solder for example. Then, the conversion spacer to which the through-hole mounted type electronic component is fit is surface mounted on the electronic board by soldering or the like through the board mounting pins 3-1, 3-2.</p>