SYSTEME DE CONNEXION ELECTRIQUE ET D'EVACUATION DE LA CHALEUR PAR CONDUCTION DE COMPOSANTS ELECTRONIQUES,申请号FR19820005254-传众专利搜索

SYSTEME DE CONNEXION ELECTRIQUE ET D'EVACUATION DE LA CHALEUR PAR CONDUCTION DE COMPOSANTS ELECTRONIQUES

申请公布号：FR2524203(B1)

申请号：FR19820005254

申请日期：1982.03.26

申请公布日期：1985.09.13

申请人：

SOCAPEX

分类号：H05K1/02;H05K1/14;H05K7/20

主分类号：H05K1/02

摘要：The system includes a mother board (101) formed of a printed circuit (133) and heat sink (134) supports two electrical connectors (135,136) between which the substrate (106) is carried. Two circuits (131,141) of chip-carrier type are bonded conventionally to the underside of the substrate (106), and housed in recesses (151,152) in a heat radiator (142). An electrical connection circuit links the electronic components to the end connectors (135,136). Thermal contact is ensured by connections (144) between the radiator (142) and chip-carriers (131,141), as well as between the substrate (106) and radiator (142) in regions (153-155) which are not covered by the components. The radiator is screwed (145) firmly to the heat sink (134). The height of the radiator (142) in the regions which do not include the recesses (151,152) is substantially equal to the distance between the substrate (106) and heat sink.