APPLYING APPARATUS,申请号JP19850009031-传众专利搜索

APPLYING APPARATUS

申请公布号：JPS61168918(A)

申请号：JP19850009031

申请日期：1985.01.23

申请公布日期：1986.07.30

申请人：

HITACHI LTD

发明人：HASHIMOTO TAKAYOSHI

分类号：B05C11/08;G03F7/16;H01L21/027;H01L21/30

主分类号：B05C11/08

摘要：PURPOSE:To decrease defects in an applied film, by providing an exhausting fan, which generates an exhausting air stream for an applying material, which is applied on another material, on the rotary shaft of a motor, which rotates a rotary table, on which the material under application is mounted so that it is freely mounted and removed. CONSTITUTION:A duct 8 is provided at a lower part of an applying cup 1. In the duct 8, an air exhausting fan 9, which forms a downward stream in the duct 8, is connected to a rotary shaft 3 that is protruded downward from the motor 4. The fan 9 is rotated in synchronization with a spinner 2. Droplets of excessive photoresist 7 are splashed to the wall surface of the applying cup 1 from the peripheral part of a wafer 5, which is fixed to the spinner 2 and rotated. The droplets are exhausted in the duct 8 under the applying cup 1 by the exhausting stream. The droplets of the excessive photoresist 7 are not repelled by the wall surface of the applying cup 1 and are not attached to the photoresist film formed on the wafer 5. Therefore, defects are not yielded in the photoresist film formed on the wafer 5.