ASSEMBLING CONSTRUCTION OF SEMICONDUCTOR DEVICE,申请号JP19770156136-传众专利搜索

ASSEMBLING CONSTRUCTION OF SEMICONDUCTOR DEVICE

申请公布号：JPS5488080(A)

申请号：JP19770156136

申请日期：1977.12.24

申请公布日期：1979.07.12

分类号：H01L21/52;H01L21/58;H01L23/12

主分类号：H01L21/52

摘要：PURPOSE:To place the chip by providing silver layer on the stage and leads after coated with Al, by simplifying the drawing out of the rear electrodes through placing Si chip on the stage provided in connection with the lead frame incorporatedly. CONSTITUTION:The chip 7 is placed on the stage 10 incorporated with the lead frame 8. The stage 10 has a concave and when the chip is placed in it, the frame and the chip are at the same surface level. The frame and the stage are fixed on the ceramic base 13 with low melting point glass 12. Sinver thin paper is sticked on the Al coating surface 11 of the stage and the Si chip is bonded to the silver layer by inserting the golden pellet 15. Thus, the drawing out of the rear electrodes can easily be ensured with the leads 9, 9', the work can remarkably be simplified, and the amount of golden pellet is very less.