METHOD OF ALLOYING SEMICONDUCTOR PELLET
申请公布号:JPS5244566(A)
申请号:JP19750120430
申请日期:1975.10.06
申请公布日期:1977.04.07
发明人:SADAMORI MASAAKI
分类号:H01L21/52;H01L21/28;H01L21/58
主分类号:H01L21/52
摘要:PURPOSE:To thicken a soldering material on the portions which mate and contact with the circumferential edges of a pellet, thereby firmly alloy and bond the pellet to a substrate while preventing cavity or penetration.
KALIBRERING AV YTRAHETSDETEKTOR
NOTNINGSBESTENDIGT KOMPOSITMATERIAL
APPARECCHIATURA PER MASSAGGIO PNEUMATICO
VALVOLA MISCELATRICE PARTICOLARMENTE PER IMPIEGHI IGIENICO SANITARI
DYED YARN PROCESSING OF SYNTHETIC RAW YARN
PREVENTION OF PILE REMOVAL OF PILE FABRIC
FIBER HAVING NEUTRON SHIELDING ABILITY
DYEING METHOD OF BRAIDED ALUMINUM SUCH AS METAL MESH AND SUPPORT FOR ITS DYEING
TREATMENT OF AMORPHOUS MAGNETIC ALLOY MATERIAL
STEEL FOR PIPELINE WITH SUPERIOR SULFIDE STRESS CORROSION CRACK RESISTANCE
TURNING METHOD OF SHIP BODY AT LAUNCHING
DRIVE TYPE FRONT WHEEL HEIGHT CHANGER FOR TRACTOR
CAR BODY CEILING COVER FOR BLOCKING SOLAR RADIATION
LENS APPARATUS FOR WELDING HELMET