Semiconductor packaging identifier,申请号US200812057648-传众专利搜索

Semiconductor packaging identifier

申请公布号：US8999752(B1)

申请号：US200812057648

申请日期：2008.03.28

申请公布日期：2015.04.07

申请人：

Cypress Semiconductor Corporation

发明人：Chang Bo Soon

分类号：H01L23/544

主分类号：H01L23/544

地址：San Jose CA US

摘要：An embodiment of the present invention is directed to a semiconductor packaging frame allowing identification information to be stored in the paddle area of the individual frame. Forming identification information on the paddle allows unique tracking of the semiconductor frame package during and after manufacturing and for tracking down variances, defects, and other problems during the semiconductor packaging process. Further, the shapes formed from the identification information provide increased surface area for bonding of the molding compound and thus strengthen the bond between the die paddle and molding compound thereby improving the strength of the semiconductor package.

主权项：1. A method for forming a semiconductor package frame comprising: forming a plurality of openings for wires in a material; receiving identification information; and forming a plurality of markings within a paddle area of said material based on said identification information, wherein the paddle area comprises a die-mounting surface for mounting a die, wherein said identification information uniquely identifies said material from among a plurality of other lead frames, each of the plurality of other lead frames comprising identification information unique to each of the respective plurality of other lead frames.