PARTIAL PLATING METHOD,申请号KR19750000982-传众专利搜索

PARTIAL PLATING METHOD

申请公布号：KR800000215(B1)

申请号：KR19750000982

申请日期：1975.05.06

申请公布日期：1980.03.22

申请人：

SHIN NIPPON DENKI CO LTD

发明人：ICHIKAWA DEZUO;MIZUTANI DECHUO;MURAKI YOSHIHIKO;SAMEJIMA YUKIHARU;WUETA KACHUJI

分类号：C25D5/02;(IPC1-7):C25D5/02

主分类号：C25D5/02

摘要：A partial plating method is fitted for the element (2) of the lead frame(1) and the adherent side(3) of the fine line (7,8), particularly in fabricating the semi-conductor apparatus of the mould frame. A tape is adhered to the plated side of metallic board, and above tape is plated with the coating layer made of meltable material through the whole.