COPPER-BASED ALLOYS AND THEIR USE FOR INFILTRATION OF POWDER METAL PARTS
申请公布号:US2017021421(A1)
申请号:US201615079099
申请日期:2016.03.24
申请公布日期:2017.01.26
发明人:Rivest Paul
分类号:B22F3/26;C22C9/04
主分类号:B22F3/26
地址:Carmel IN US
摘要:Described are wrought forms of copper alloys for infiltrating powder metal parts, the method for preparing the copper alloys and their wrought forms, the method for their infiltration into a powder metal part, and the infiltrated metal part infiltrated with the novel alloys having a generally uniform distribution of copper throughout and exhibiting high transverse rupture strength, tensile strength and yield strength. Infiltrated metal parts prepared by infiltrating powder metal parts with reduced amounts of the novel infiltrant typically weigh less and have superior strengths compared to similarly prepared infiltrated metal parts prepared with standard methods and conventional infiltration.
主权项:1. A method for infiltrating a powder metal part, the method comprising: a) providing the powder metal part; b) providing a copper alloy having a homogeneous wrought form adapted to contact a surface of the powder metal part, c) contacting the alloy with a surface of the powder metal part; and d) heating the alloy and the powder metal part to a temperature sufficient to cause the alloy to melt and infiltrate the powder metal part, wherein the alloy comprises: (i) at least about 85 weight % copper; and ii) about 0.5 to about 3.5 weight % iron.
BIOMETRICS APPARATUS AND ELECTRONIC EQUIPMENT PROVIDED WITH THE SAME
PRESSURE-CONTACT SEMICONDUCTOR DEVICE
IMAGE PROCESSING APPARATUS, IMAGE FORMING APPARATUS, AND PROGRAM
ELECTRONIC DEVICE, ORGANIC ELECTROLUMINESCENT DEVICE, AND ORGANIC THIN FILM SEMICONDUCTOR DEVICE
RADIATION DETECTOR AND RADIATION IMAGING APPARATUS
LIQUID CRYSTAL DEVICE AND ELECTRONIC APPARATUS
IMAGING APPARATUS, AND IMAGING METHOD