Device for releasing an interconnect layer that provides connection between a carrier and a wafer,申请号US201313961940-传众专利搜索

Device for releasing an interconnect layer that provides connection between a carrier and a wafer

申请公布号：US8905111(B2)

申请号：US201313961940

申请日期：2013.08.08

申请公布日期：2014.12.09

申请人：

EV Group GmbH

发明人：Thallner Erich

分类号：B32B38/10;B32B43/00;H01L21/67

主分类号：B32B38/10

代理机构：

Kusner & Jaffe

代理人：Kusner & Jaffe

地址：St. Florian AT

摘要：A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.

主权项：1. Device for releasing an interconnect layer that provides a connection between a carrier and a wafer to form a carrier-wafer combination, wherein said interconnect layer provides the connection at a peripheral edge of the carrier-wafer combination said device comprising: a connection release means for providing an immersion bath that receives the carrier-wafer combination to unfix the connection, said connection release means including: a working chamber for surrounding only a section of the peripheral edge of the carrier-wafer combination, andmeans for delivering a solvent to the working chamber to fill at least a portion of the working chamber with the solvent, said solvent for dissolving the interconnect layer at the peripheral edge of the carrier-wafer combination; and a rotation means for rotating the carrier-wafer combination to move only the peripheral edge of the carrier-wafer combination through the working chamber of the connection release means to contact only the peripheral edge of the carrier-wafer combination with the solvent filling the working chamber, thereby releasing the interconnect layer from at least one of the carrier and the wafer and breaking the connection at the peripheral edge of the carrier-wafer combination.