CLEANING SOLVENT AND CLEANING METHOD FOR METALLIC COMPOUND
申请公布号:EP2542709(A1)
申请号:EP20110750264
申请日期:2011.02.26
申请公布日期:2013.01.09
发明人:SAKATA, YOICHI
分类号:C23C16/44;C11D7/50;H01L21/205;H01L21/304
主分类号:C23C16/44
摘要:<p>Disclosed are cleaning solvents and cleaning methods for metallic compounds deposited on the equipment that supplies organometallic compounds to the manufacturing tool in the photovoltaic industry or the semiconductor industry. The cleaning solvents and the cleaning methods disclosed not only selectively remove the metallic compound without corroding the equipment, but also improve the ordinary cleaning process. Moreover, the cleaning solvents and the cleaning methods disclosed improve maintenance costs for the supply system because the equipment may be cleaned without being detached from the supply system.</p>
Iodine-hydrophilic polymer addition products - for treatment of uterine infections, esp. in cows
DIACRYLATES D'HYDANTOINES ET LEURS APPLICATIONS COMME MATIERES RESINEUSES
PROCEDE ET DISPOSITIF DE COMMANDE D'UN JEU DE PISTONS DE PRESSE
ACCELERATEUR NON EFFLORESCENT DE LA VULCANISATION DE TERPOLYMERES ELASTOMERES, ET SON APPLICATION
NOUVEAUX DERIVES D'ACIDE HYDROXAMIQUE ET MEDICAMENTS EN CONTENANT
MACHINE DE CABLAGE ET DE GUIPAGE
DISPOSITIF DE COMMANDE DU FONCTIONNEMENT DE HAUT-PARLEURS PAR DES SIGNAUX VOCAUX