MULTI-LAYER THICK-FILM RF PACKAGE,申请号US20100941401-传众专利搜索

MULTI-LAYER THICK-FILM RF PACKAGE

申请公布号：US2011117705(A1)

申请号：US20100941401

申请日期：2010.11.08

申请公布日期：2011.05.19

申请人：

MICROSEMI CORPORATION

发明人：SAMPLES BENJAMIN A.

分类号：H01L21/50;H05K1/11

主分类号：H01L21/50

摘要：A method for producing a multi-layer thick-film RF package includes forming conductive layer(s) including one or more source portions, one or more gate portions, and/or one or more drain portions on a ceramic substrate. The conductive layer(s) and the ceramic substrate are fired or otherwise heated in a furnace until sintered. Thereafter, a dielectric pattern is formed on the conductive layer(s) and fired or otherwise heated in the furnace until sintered. Then, a conductive bridge is formed on the dielectric pattern, over the one or more drain portions and between the one or more source portions, which is then fired until sintered in the furnace. As a result, a monolithic, single-piece, sintered, high-frequency RF power transistor package having circuit features including a highly conductive and low capacitive bridge is produced.