TERMINAL PAIR AND ELECTRIC CONNECTION STRUCTURE USING THIS,申请号JP20090233969-传众专利搜索

TERMINAL PAIR AND ELECTRIC CONNECTION STRUCTURE USING THIS

申请公布号：JP2011082041(A)

申请号：JP20090233969

申请日期：2009.10.08

申请公布日期：2011.04.21

申请人：

AUTONETWORKS TECHNOLOGIES LTD;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD

发明人：SHIMIZU ATSUSHI

分类号：H01R13/03

主分类号：H01R13/03

摘要：PROBLEM TO BE SOLVED: To suppress electrical resistance between terminals to constitute a terminal pair by using liquid metal, and prevent in advance an increase in the electrical resistance caused by deterioration of the liquid metal. SOLUTION: An electrical connection structure includes a male terminal 10 and a female terminal 20, and the liquid metal 30 having a low melting point is interposed between them. The liquid metal 30 contains gallium, and at least one of indium and tin. The male terminal 10 and the female terminal 20 include a base material made of copper or a copper alloy, and a gallium reaction suppressing layer formed on its surface. The gallium reaction suppressing layer is made of a material having lower reactivity with gallium in the liquid metal than the base material, and by preventing reaction between gallium in the liquid metal and copper to constitute the base material, rise in the melting point of the liquid metal due to the reaction is suppressed. COPYRIGHT: (C)2011,JPO&INPIT