HEAT TREATMENT APPARATUS AND CONTROL METHOD THEREFOR,申请号US20100814547-传众专利搜索

HEAT TREATMENT APPARATUS AND CONTROL METHOD THEREFOR

申请公布号：US2010248396(A1)

申请号：US20100814547

申请日期：2010.06.14

申请公布日期：2010.09.30

申请人：

TOKYO ELECTRON LIMITED

发明人：OGOSE KEI

分类号：H01L21/477;H01L21/46

主分类号：H01L21/477

摘要：A heat treatment apparatus includes a processing chamber having a gate valve at a sidewall and a cover at a ceiling via a sealing member; a gate valve heating unit provided at the gate valve; a processing chamber heating unit provided at a sidewall of the processing chamber; and a temperature controller that controls a set temperature for the sidewall of the processing chamber adjacent to the gate valve to be lower than a set temperature for an opposite sidewall of the processing chamber from the gate valve by controlling the processing chamber heating unit. The two set temperatures are set to be higher than a sublimation temperature of a reaction by-product, or higher than a condensation temperature of the gas, and the two set temperatures are also set to be lower than a temperature at which an amount of a gas permeating the sealing member increases.