DEVICE AND METHOD FOR FORMING WIRE,申请号JP20080308815-传众专利搜索

DEVICE AND METHOD FOR FORMING WIRE

申请公布号：JP2010135498(A)

申请号：JP20080308815

申请日期：2008.12.03

申请公布日期：2010.06.17

申请人：

SEIKO EPSON CORP

发明人：YAJIMA MASARU;SATO HIDEKAZU

分类号：H01L23/52;H01L21/60

主分类号：H01L23/52

摘要：PROBLEM TO BE SOLVED: To provide a device and method for forming a wire, capable of forming a wire connecting a mounting board to an electronic component mounted on the mounting board in accordance with displacement of the electronic component while suppressing change of its electrical characteristic. SOLUTION: The device and method for forming a wire includes wire correction data LP where the volume of a liquid body specifying the cross section of a metal wire is related to the wire length of the wire under a condition that an electrical characteristic related to the metal wire 30I is secured; in a form where a board electrode pad 16I is connected to a chip electrode pad, the wire length of the metal wire is corrected in accordance with relative displacement between the electrode pads; and the metal wire is formed using wire width W in accordance with the volume of the liquid body related to the wire length after the correction. COPYRIGHT: (C)2010,JPO&INPIT