CHIP STACKED STRUCTURE AND METHOD OF FABRICATING SAME

申请公布号：JP2009016830(A)

申请号：JP20080169305

申请日期：2008.06.27

申请公布日期：2009.01.22

申请人：

DONGBU HITEK CO LTD

发明人：JUNG CHUNG-KYUNG

分类号：H01L25/065;H01L21/3205;H01L23/52;H01L25/07;H01L25/18

主分类号：H01L25/065

摘要：<P>PROBLEM TO BE SOLVED: To provide a chip stacked structure and a method of fabricating the same. <P>SOLUTION: The chip stacked structure includes a first chip having first semiconductor devices and a first connection pad electrically connected to the first semiconductor devices, a second chip stacked on the first chip, the second chip having second semiconductor devices and a second connection pad electrically connected to the second semiconductor devices, and a connection member interposed between the first connection pad and the second connection pad to electrically connect the first connection pad and the second connection pad. The connection member has lower electric resistance than when the chips are unstacked, or when the connection pads are not located oppositely to each other and thus, offers high reliability and performance. <P>COPYRIGHT: (C)2009,JPO&INPIT

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