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Microchips and its Manufacturing Methods Thereof
申请公布号：US2008305537(A1)
申请号：US20070944059
申请日期：2007.11.21
申请公布日期：2008.12.11
发明人：SATO SETSUYA;MATSUMOTO YOSHITAKA;TERAMOTO TOSHIO;MOROHOSHI KIMITAKA
分类号：C12M1/14;C23C14/54
主分类号：C12M1/14
摘要：A microchip is provided with a lower substrate configured as the lower portion of the microchip, an intermediate section formed on the top of the lower substrate, and an upper substrate formed on the top of the intermediate section, wherein the lower substrate, the intermediate section, and the upper substrate are made of light-transmissive and cured resin.