DETECTION UNIT MOLD PACKAGE, AND FLUID DISCRIMINATION SENSOR MODULE USING THE MOLD PACKAGE,申请号WO2008JP58563-传众专利搜索

DETECTION UNIT MOLD PACKAGE, AND FLUID DISCRIMINATION SENSOR MODULE USING THE MOLD PACKAGE

申请公布号：WO2008143013(A1)

申请号：WO2008JP58563

申请日期：2008.05.08

申请公布日期：2008.11.27

申请人：

NAKAMURA, TOSHIMI;MITSUI MINING & SMELTING CO., LTD.

发明人：NAKAMURA, TOSHIMI

分类号：G01N25/18

主分类号：G01N25/18

摘要：<p>Provided is a detection unit mold package (2A), which is equipped with plate-shaped protrusions (21P and 22P) to contact an object liquid so as to exchange the heat with the object liquid. The plate-shaped protrusions (21P and 22P) are formed by sealing a liquid-kind detecting unit (21a) and a liquid-temperature detecting unit (22a), which are made of thin-film chips containing at least temperature-sensitive elements, and metallic die pads (21c and 22c) having those detecting units jointed thereto, with a sealing material (23), so that they may not be exposed to the surface. The plate-shaped protrusions (21P and 22P) have their two principal planes in parallel with the metallic die pads (21c and 22c).</p>