Digital camera module using stacked chip package

申请公布号：US2007165136(A1)

申请号：US20060592912

申请日期：2006.11.03

申请公布日期：2007.07.19

申请人：

ALTUS TECHNOLOGY INC.

发明人：WU YING-CHENG;SU YING-TANG

分类号：H04N5/225

主分类号：H04N5/225

摘要：A digital camera module ( 10 ) includes a chip package ( 101 ) and a lens module ( 103 ) mounted on the chip package. The chip package includes a substrate ( 20 ), a first chip ( 40 ), a second chip ( 70 ), and a cover ( 80 ). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires ( 50 a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires ( 50 b). The cover is mounted above the second chip and the wires connected with the second chip.

附加制动器制动性能的检测设备

具有可移动厚隔膜的微机电系统结构

一种炼油碱渣的处理方法

一种实验级RTM恒压注射系统及恒压注射的方法

一种含纳米中空碳材料的制备方法

FinFET Low Resistivity Contact Formation Method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

LOCAL BURIED CHANNEL DIELECTRIC FOR VERTICAL NAND PERFORMANCE ENHANCEMENT AND VERTICAL SCALING

DEFECT-FREE STRAIN RELAXED BUFFER LAYER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

EPITAXIAL STRUCTURE AND GROWTH THEREOF

DISPLAY

SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS

TWO-DIMENSIONAL SOLID-STATE IMAGE CAPTURE DEVICE WITH POLARIZATION MEMBER AND COLOR FILTER FOR SUB-PIXEL REGIONS AND POLARIZATION-LIGHT DATA PROCESSING METHOD THEREFOR

PHOTOELECTRIC CONVERSION DEVICE

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING MEMORY CELLS AND INTEGRATED CIRCUITS

FinFET with Multiple Dislocation Planes and Method for Forming the Same

Semiconductor Device with Transistor Cells and Enhancement Cells

Method for Producing an Optoelectronic Semiconductor Chip