MICROELECTRONIC PACKAGES AND METHODS THEREFOR,申请号WO2004US42415-传众专利搜索

MICROELECTRONIC PACKAGES AND METHODS THEREFOR

申请公布号：WO2005065207(A2)

申请号：WO2004US42415

申请日期：2004.12.16

申请公布日期：2005.07.21

申请人：

TESSERA, INC.;HABA, BELGACEM;BEROZ, MASUD;GREEN, RONALD;MOHAMED, ILYAS;WILSON, STUART, E.;ZOHNI, WAEL;KUBOTA, YOICHI;THOMPSON, JESSE, BURL

发明人：HABA, BELGACEM;BEROZ, MASUD;GREEN, RONALD;MOHAMED, ILYAS;WILSON, STUART, E.;ZOHNI, WAEL;KUBOTA, YOICHI;THOMPSON, JESSE, BURL

分类号：H01L21/44

主分类号：H01L21/44

摘要：A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).