Chemical mechanical polishing optical endpoint detection

申请公布号：US6896588(B2)

申请号：US20030678784

申请日期：2003.10.03

申请公布日期：2005.05.24

申请人：

TEXAS INSTRUMENTS INCORPORATED

发明人：LANIER BARRY;ZINN BRIAN E.

分类号：B24B37/04;B24B49/12;(IPC1-7):B24B1/00

主分类号：B24B37/04

摘要：Light is incident on a semiconductor wafer polish surface and an adjacent reference surface ( 80 ). The reflected light from each surface is detected by a detector ( 35 ) positioned beneath the surfaces. The signals derived from each source of reflected light is analyzed in a electronic system ( 37 ) and an endpoint for a chemical mechanical polish process is determined as a function of both signals.

VIBRATION CONTROL DEVICE FOR STEERING WHEEL

MEDICAL WEAR FOR PETS

POWER SEMICONDUCTOR DEVICE

MANUFACTURE OF PHASED SPROCKET ASSEMBLY AND PHASED SPROCKET ASSEMBLY

COLORED MORTAR

MANUFACTURE OF MULTI-PURPOSE PRACTICAL BAND

CONCRETE MATERIAL

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Method for making a microceramic optical shutter

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