THERMAL TRANSFER RECEIVING SHEET AND IC CARD,申请号JP20030019987-传众专利搜索

THERMAL TRANSFER RECEIVING SHEET AND IC CARD

申请公布号：JP2004230633(A)

申请号：JP20030019987

申请日期：2003.01.29

申请公布日期：2004.08.19

申请人：

OJI PAPER CO LTD

发明人：UCHIDA KYOKO;KUBO NAOKI

分类号：B42D15/10;B41M5/382;B41M5/40;B41M5/50;B41M5/52;G06K19/077

主分类号：B42D15/10

摘要：<P>PROBLEM TO BE SOLVED: To provide a receiving sheet which is excellent in adhesive strength between a sheet-like substrate and an undercoat-coated layer and a receiving layer, and has good dyeing properties of a dye, melted ink transferring properties and processability for molding a card or the like, without a problem wherein when a dye-dyeable resin is dissolved in an organic solvent and the receiving layer is formed by coating or printing on the sheet-like substrate, the surface is swollen to spoil the appearance, or the organic solvent remains in the sheet-like substrate, and to provide an IC card using this. <P>SOLUTION: The sheet-like substrate comprising an acrylonitrile-butadiene-styrene copolymer resin as a main component, the undercoat-coated layer comprising an aqueous polymer resin on at least one face of the sheet-like substrate, and the receiving layer comprising a dye-dyeable resin are successively laminated in this order. <P>COPYRIGHT: (C)2004,JPO&NCIPI