Substrate for receiving a circuit configuration and method for producing the substrate

申请公布号：US2003110627(A1)

申请号：US20020308049

申请日期：2002.12.02

申请公布日期：2003.06.19

申请人：

FERBER GOTTFRIED;PELMER REIMUND

发明人：FERBER GOTTFRIED;PELMER REIMUND

分类号：H01L23/12;H01L23/13;H01L23/373;H01L23/498;H01L25/07;H01L25/18;H05K1/00;H05K1/03;H05K3/34;H05K3/40;(IPC1-7):H05K3/36

主分类号：H01L23/12

摘要：A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.

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