HEATING ELEMENT SUITABLE FOR PRECONDITIONING PRINT MEDIA
申请公布号:WO0057674(B1)
申请号:WO2000US07599
申请日期:2000.03.23
申请公布日期:2000.12.07
发明人:RUTHERFORD, JAMES, M.;ECKMAN, CHARLES, J.;VON ARX, THEODORE
分类号:H05B3/00;H05B3/46;H05B3/48;H05B3/78;H05B3/82;(IPC1-7):H05B3/78
主分类号:H05B3/00
摘要:Heating elements (100) suitable for heating a printing media of an ink-jet printer are provided. The heating element (100) includes an electrical resistance heating member (26) for generating resistance heating and a polymeric supporting layer (113) for substantially encapsulating the electrical resistance heating member (26). The heating element (100) of this invention can include a fibrous support layer (114) disposed over the electrical resistance heating member (26) for assisting in the application of the polymeric layer (113). Additionally, the provided heating elements (100) can be formed into a portion of a media pathway for an ink-jet printer.
IN-VEHICLE DEVICE OF POWER UNIT
CONNECTING STRUCTURE OF HOOD LOCK STAY
METHOD FOR CONTROLLING BACK PRESSURE OF SCREW OF ELECTROMOTIVE INJECTION MOLDING MACHINE
MACHINE FOR PREPARING BUNDLE OF TAG PAPER
PRINTING PLATE AND PRINTING METHOD
MOLDING MACHINE FOR MOLDING PLURALITY OF MATERIALS AND METHOD FOR MOLDING PLURALITY OF MATERIALS
MULTILAYERED BARRIER FILM AND PACKAGE USING THE SAME
ASSEMBLY DETERMINATION DEVICE AND ARTICLE STRUCTURE AND JIG STRUCTURE USED FOR IT
APPARATUS AND METHOD FOR GRINDING SURFACE OF LIQUID CRYSTAL PANEL
METHOD OF JOINING ELECTROCONDUCTIVE THIN WIRE WITH FINE OUTSIDE DIAMETER
MOLD COOLING STRUCTURE AND MOLD COOLING METHOD USING THE SAME