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Vapor phase soldering system
申请公布号：US4762264(A)
申请号：US19870095485
申请日期：1987.09.10
申请公布日期：1988.08.09
发明人：PECK, DOUGLAS J.
分类号：B23K1/015;(IPC1-7):B23K3/04
主分类号：B23K1/015
摘要：A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus temperature of eutectic solder. Work product is sequentially passed through these vapors and is first preheated and then reflowed.