CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

申请公布号：KR20110134107(A)

申请号：KR20100053906

申请日期：2010.06.08

申请公布日期：2011.12.14

申请人：

CHUNG-ANG UNIVERSITY INDUSTRY-ACADEMY COOPERATIONFOUNDATION;SEOUL NATIONAL UNIVERSITY OF TECHNOLOGY CENTER FOR INDUSTRY COLLABORATION

发明人：SHIN, YOUNG EUI;JEON, YU JAE;KIM, DO SEOK

分类号：H05K1/14;H05K7/20

主分类号：H05K1/14

摘要：PURPOSE: A circuit board assembly and a manufacturing method thereof are provided to minimize heat generated during a high-density mounting process of circuit boards. CONSTITUTION: A circuit board assembly(200) includes a plurality of circuit boards(210,220,230,240,250). A semiconductor chip(211,221,231) is included within the circuit board. A lateral electrode(212,222,232,242,252) is arranged in a lateral surface of the circuit board. The lateral electrode is connected to an output end of the semiconductor chip. The lateral electrode electrically connects the two circuit boards adjacent to each other.

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