SOCKET FOR SEMICONDUCTOR DEVICE WITH TRANSFORMATION SUBSTRATE,申请号JP20040253343-传众专利搜索

SOCKET FOR SEMICONDUCTOR DEVICE WITH TRANSFORMATION SUBSTRATE

申请公布号：JP2006073277(A)

申请号：JP20040253343

申请日期：2004.08.31

申请公布日期：2006.03.16

申请人：

YAMAICHI ELECTRONICS CO LTD

发明人：KAWAMURA NOBUO;TAKAHASHI KATSUNORI;TAKANO NORIYUKI

分类号：H01R31/06;G01R31/26;G01R31/28;H01R13/24;H01R33/76;H05K1/18

主分类号：H01R31/06

摘要：PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device with a transformation substrate which can mount detachably the socket for the semiconductor device having the transformation substrate on a mother board such as a test substrate a bar-in board or the like without soldering. SOLUTION: The socket for the semiconductor device has a plurality of contacts electrically connected to a semiconductor device to be mounted and has a socket body of which the lower part is fitted with a transformation substrate. The socket is connected through a connecting pin which has an intermediate connecting part and an arm capable of elastic deformation provided on its upper part and/or lower part so that the socket for the semiconductor device with the transformation substrate may be fitted maintaining a prescribed space to the mother board. COPYRIGHT: (C)2006,JPO&NCIPI